Probleme RAM
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Helpmeplz31
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80
Date d'inscription
dimanche 15 octobre 2017
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Modifié le 5 févr. 2018 à 20:17
Helpmeplz31 Messages postés 80 Date d'inscription dimanche 15 octobre 2017 Statut Membre Dernière intervention 19 février 2024 - 5 févr. 2018 à 20:27
Helpmeplz31 Messages postés 80 Date d'inscription dimanche 15 octobre 2017 Statut Membre Dernière intervention 19 février 2024 - 5 févr. 2018 à 20:27
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Helpmeplz31
Messages postés
80
Date d'inscription
dimanche 15 octobre 2017
Statut
Membre
Dernière intervention
19 février 2024
3
5 févr. 2018 à 20:27
5 févr. 2018 à 20:27
RAMMon v1.0 Build: 1016 built with SysInfo v1.0 Build: 1121
PassMark (R) Software
www.passmark.com
Memmory summary for DESKTOP-42LQO6F:
Number of Memory Devices: 2 Total Physical Memory: 8091 MB (16384 MB)WTTTFFFFFF ils sont detectés
Total Available Physical Memory: 4524 MB
Memory Load: 44%
Item | Slot #1 | Slot #2 |
-------------------------------------------------------------------------------|------------------------|------------------------|-
Ram Type | DDR3 | DDR3 |
Maximum Clock Speed (MHz) | 934 (JEDEC) | 934 (JEDEC) |
Maximum Transfer Speed (MHz) | DDR3-1867 | DDR3-1867 |
Maximum Bandwidth (MB/s) | PC3-14900 | PC3-14900 |
Memory Capacity (MB) | 8192 | 8192 |
Jedec Manufacture Name | Micron Technology | Kingston |
Search Amazon.com | Search! | Search! |
SPD Revision | 1.3 | 1.1 |
Registered | No | No |
ECC | No | No |
DIMM Slot # | 1 | 2 |
Manufactured | Week 23 of Year 2016 | Week 51 of Year 2017 |
Module Part # | 16KTF1G64AZ-1G9P1 | KHX1866C10D3/8G |
Module Revision | 0x5031 | 0x0 |
Module Serial # | 0x12E5D079 | 0x1B26D5B6 |
Module Manufacturing Location | 15 | 7 |
# of Row Addressing Bits | 16 | 16 |
# of Column Addressing Bits | 10 | 10 |
# of Banks | 8 | 8 |
# of Ranks | 2 | 2 |
Device Width in Bits | 8 | 8 |
Bus Width in Bits | 64 | 64 |
Module Voltage | 1.5V, 1.35V | 1.5V |
CAS Latencies Supported | 5 6 7 8 9 10 11 13 | 5 6 7 8 9 10 11 13 |
Timings @ Max Frequency (JEDEC) | 13-13-13-32 | 10-11-10-30 |
Maximum frequency (MHz) | 934 | 934 |
Maximum Transfer Speed (MHz) | DDR3-1867 | DDR3-1867 |
Maximum Bandwidth (MB/s) | PC3-14900 | PC3-14900 |
Minimum Clock Cycle Time, tCK (ns) | 1.071 | 1.071 |
Minimum CAS Latency Time, tAA (ns) | 13.125 | 10.700 |
Minimum RAS to CAS Delay, tRCD (ns) | 13.125 | 11.781 |
Minimum Row Precharge Time, tRP (ns) | 13.125 | 10.700 |
Minimum Active to Precharge Time, tRAS (ns) | 34.000 | 32.125 |
Minimum Row Active to Row Active Delay, tRRD (ns) | 5.000 | 5.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 47.125 | 44.700 |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 260.000 | 260.000 |
| | |
DDR3 Specific SPD Attributes | | |
Write Recovery Time, tWR (ns) | 15.000 | 15.000 |
Internal Write to Read Command Delay, tWTR (ns) | 7.500 | 7.500 |
Internal Read to Precharge Command Delay, tRTP (ns) | 7.500 | 7.500 |
Minimum Four Activate Window Delay, tFAW (ns) | 27.000 | 27.000 |
Maximum Activate Window in units of tREFI | 0 | 0 |
RZQ / 6 Supported | Yes | Yes |
RZQ / 7 Supported | Yes | Yes |
DLL-Off Mode Supported | Yes | Yes |
Maximum Operating Temperature Range (C) | 0-95 | 0-95 |
Refresh Rate at Extended Operating Temperature Range | 2X | 2X |
Auto-self Refresh Supported | Yes | No |
On-die Thermal Sensor Readout Supported | No | No |
Partial Array Self Refresh Supported | No | No |
Thermal Sensor Present | No | No |
Non-standard SDRAM Type | Standard Monolithic | Standard Monolithic |
Maxium Activate Count (MAC) | | |
Module Type | UDIMM | UDIMM |
Module Height (mm) | 30 | 30 |
Module Thickness (front), (mm) | 2 | 2 |
Module Thickness (back), (mm) | 2 | 2 |
Module Width (mm) | 133.5 | 133.5 |
Reference Raw Card Used | Raw Card B Rev. 1 | Raw Card B Rev. 1 |
DRAM Manufacture | Micron Technology | |
PassMark (R) Software
www.passmark.com
Memmory summary for DESKTOP-42LQO6F:
Number of Memory Devices: 2 Total Physical Memory: 8091 MB (16384 MB)WTTTFFFFFF ils sont detectés
Total Available Physical Memory: 4524 MB
Memory Load: 44%
Item | Slot #1 | Slot #2 |
-------------------------------------------------------------------------------|------------------------|------------------------|-
Ram Type | DDR3 | DDR3 |
Maximum Clock Speed (MHz) | 934 (JEDEC) | 934 (JEDEC) |
Maximum Transfer Speed (MHz) | DDR3-1867 | DDR3-1867 |
Maximum Bandwidth (MB/s) | PC3-14900 | PC3-14900 |
Memory Capacity (MB) | 8192 | 8192 |
Jedec Manufacture Name | Micron Technology | Kingston |
Search Amazon.com | Search! | Search! |
SPD Revision | 1.3 | 1.1 |
Registered | No | No |
ECC | No | No |
DIMM Slot # | 1 | 2 |
Manufactured | Week 23 of Year 2016 | Week 51 of Year 2017 |
Module Part # | 16KTF1G64AZ-1G9P1 | KHX1866C10D3/8G |
Module Revision | 0x5031 | 0x0 |
Module Serial # | 0x12E5D079 | 0x1B26D5B6 |
Module Manufacturing Location | 15 | 7 |
# of Row Addressing Bits | 16 | 16 |
# of Column Addressing Bits | 10 | 10 |
# of Banks | 8 | 8 |
# of Ranks | 2 | 2 |
Device Width in Bits | 8 | 8 |
Bus Width in Bits | 64 | 64 |
Module Voltage | 1.5V, 1.35V | 1.5V |
CAS Latencies Supported | 5 6 7 8 9 10 11 13 | 5 6 7 8 9 10 11 13 |
Timings @ Max Frequency (JEDEC) | 13-13-13-32 | 10-11-10-30 |
Maximum frequency (MHz) | 934 | 934 |
Maximum Transfer Speed (MHz) | DDR3-1867 | DDR3-1867 |
Maximum Bandwidth (MB/s) | PC3-14900 | PC3-14900 |
Minimum Clock Cycle Time, tCK (ns) | 1.071 | 1.071 |
Minimum CAS Latency Time, tAA (ns) | 13.125 | 10.700 |
Minimum RAS to CAS Delay, tRCD (ns) | 13.125 | 11.781 |
Minimum Row Precharge Time, tRP (ns) | 13.125 | 10.700 |
Minimum Active to Precharge Time, tRAS (ns) | 34.000 | 32.125 |
Minimum Row Active to Row Active Delay, tRRD (ns) | 5.000 | 5.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) | 47.125 | 44.700 |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) | 260.000 | 260.000 |
| | |
DDR3 Specific SPD Attributes | | |
Write Recovery Time, tWR (ns) | 15.000 | 15.000 |
Internal Write to Read Command Delay, tWTR (ns) | 7.500 | 7.500 |
Internal Read to Precharge Command Delay, tRTP (ns) | 7.500 | 7.500 |
Minimum Four Activate Window Delay, tFAW (ns) | 27.000 | 27.000 |
Maximum Activate Window in units of tREFI | 0 | 0 |
RZQ / 6 Supported | Yes | Yes |
RZQ / 7 Supported | Yes | Yes |
DLL-Off Mode Supported | Yes | Yes |
Maximum Operating Temperature Range (C) | 0-95 | 0-95 |
Refresh Rate at Extended Operating Temperature Range | 2X | 2X |
Auto-self Refresh Supported | Yes | No |
On-die Thermal Sensor Readout Supported | No | No |
Partial Array Self Refresh Supported | No | No |
Thermal Sensor Present | No | No |
Non-standard SDRAM Type | Standard Monolithic | Standard Monolithic |
Maxium Activate Count (MAC) | | |
Module Type | UDIMM | UDIMM |
Module Height (mm) | 30 | 30 |
Module Thickness (front), (mm) | 2 | 2 |
Module Thickness (back), (mm) | 2 | 2 |
Module Width (mm) | 133.5 | 133.5 |
Reference Raw Card Used | Raw Card B Rev. 1 | Raw Card B Rev. 1 |
DRAM Manufacture | Micron Technology | |
